Printed circuit board production process control-specific detection

OSP measurement compared (Oxford Instruments OSPrey800 NDT)
Ultraviolet-Visible Characterization (UV-VIS)
Analysis of indirect damage
In order to get accurate results ,Preparation of accurate samples is necessary 
Can not simulate the actual situation of OSP products

Focused Ion Beam (FIB) Method
Analysis of direct damage
Operations personnel need professional and high charges
Analysis can not provide any reference point of the accident information

Sequential Electrochemical Reduction Analysis (SERA)
Analysis of direct damage
As the OSP material differences will lead to potential measurement error
OSP can not determine the actual thickness of film distribution

Fourier Transform-Infrared (FT-IR)
Analysis of indirect damage
Need to be very stable operators to get more accurate results (human influenced)
To test the degree of oxidation, rather than the thickness, not a professional choice

OSPrey800 NDT
About Test principle
The samples were placed under different wavelengths of light irradiation
Analysis of OSP film surface and the substrate from the surface of the reflected spectrum
Through the formula, according to the reflected light intensity and wavelength of the relationship between the film thickness calculated by OSP