FPC special equipment UV laser cutting machine

FPC cutting the traditional way of using mechanical press, prone to stratification and the burr. As the need to produce a mold, in the production of small volume samples and takes a long time, and the price of high-precision molds is very expensive . Using UV laser cutting avoid these problems, a high degree of flexibility, graphic design modified to facilitate and greatly improve production efficiency.
 
Suitable for UV laser processing of materials:
l polymers: polyimide, polycarbonate, polymethyl methacrylate, FR-4, PP, etc.;
l feature films: gold, silver, copper, titanium, aluminum, chromium, ITO, silicon, polycrystalline silicon, amorphous silicon and metal oxides;
l brittle materials: silicon, polysilicon, ceramics and sapphires.
UV laser cutting machine is mainly used in the production processing circuit board PCB enterprises in particular, combined with flexible and rigid-flexible circuit board contour / profile in precision cutting, also used for covering film cutting. Cutting a variety of flexible circuit board material and cover film, clean, charring, including the manufacture of common materials and manufacturing circuit board Components of the material. Combining Rigid cutting material is quite easy, just once, not bit difficult, it does not produce spikes
 
Contour / profile in precision cutting
l Flexible circuit board, rigid board, rigid - flex circuit board sub-board processing;
l have installed rigid components, flexible circuit board sub-board processing;
l below ceramic thickness of 0.6mm precision cutting, dicing;
l thin copper foil, pressure sensitive adhesive film (PSA), acrylic films, polyimide covering film;
l organic films such as precision cutting.
 
UV laser cutting machine performance advantages:
Flexible circuit board dedicated UV laser cutting machine is a light, mechanical, electrical, material processing integrated laser processing equipment.
Process:
l "cold": using UV short wavelength laser beam scans the surface of flexible circuit boards, high-energy ultraviolet photons to directly damage the surface of the molecular bonds of flexible materials to achieve the purpose of removing material, this "cold" light loss out of processing components heat affected zone is small, with smooth edges and a minimum of charring.

Features:
l High-performance UV laser: high beam quality, high peak power, narrow pulse, high pulse stability of 8W 355nm solid state laser, to ensure processing quality and stability;
l Optimization of optical systems: to ensure high beam quality, reduce power consumption, reduce the focus spot size, to ensure the accuracy of UV laser processing;
l use of sophisticated two-dimensional table and the whole closed-loop digital control system: to improve grating resolution, and ensure the machine tool positioning and repeatability;
l position sensor and CCD imaging using location technology: Laser reference point coincides with the high-precision machine tool reference point;
l high rigidity design, vibration machine pads and the base of natural granite, remove tables start / stop and speed up the processes of inertial vibration;
l control software with independent intellectual property rights of human interface, complete functions, simple operation, easy to develop. Input file format gbr and dxf, CAM software can be used directly to convert, dxf files available CAD software for easy editing.
l Development of an integrated platform of unity, expansion of arbitrary functions with high-quality, high speed cutting functions of rigid material, thickness up to 1mm (0.04 "). processed almost no burr, no heat generated in the layered effect. the result of precision cutting , smooth, steep wall with the PCB material dug blind slot features, direct forming corrosion, solder and other materials, the bottom and sidewall junction clear boundary, almost rounded, depth error of less than 25μm, especially suitable for fine design process;
l of various substrate materials cutting (silicon, ceramic, glass, etc.);
l features a precision etched thin film forming